ferroelectric films for the next generation of PICs
Pioneering
the next-generation PICs
We live in a digital world driven by AI, IoT, and emerging quantum technologies, creating a growing demand for more efficient chip hardware. Meeting this demand requires moving beyond traditional silicon-only photonic integrated circuits (PICs). At FFLOWS, we are developing high-quality ferroelectric thin films for next-generation PICs. Our technology allows seamless integration of ferroelectric films into existing photonic process flows, enabling the development of low-power, high-speed, and cost-effective PICs.
High-quality ferroelectric films
fabricated via a solution based deposition
200 nm
300 nm
Substrate
Template film
Ferroelectric film
100 nm
Technology
Custom ferroelectric film for improving modulation performance
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(100)-oriented (Pb,la)(Zr,Ti)O3 or BaTiO3
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Various range of thickness (50 - 300 nm)
Scalable and flexible material integration
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SOI, glass, ITO, PIC, ...
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Up to 300 mm diameter
We want to be an agile material supplier
to the booming PIC value chain
We are a material supplier enabling foundries to enhance their PIC platform with the best ferroelectric films that they can integrate in the most scalable and flexible way.
The
team
dr. Ewout Picavet
Business lead
dr. Andreas Laemont
Technical lead
